Company Background

MultiProbe was founded in 2001 to address the growing needs of Failure Analysis engineers, and to help the industry find solutions for deep sub-micron device technology development.  MultiProbe’s founder and CEO, Andy Erickson, leveraged many years of experience as both a semiconductor device engineer and later as an AFM (Atomic Force Microscopy) instrument designer to lead the development of MultiProbe’s core technologies and IP. In the following years, MultiProbe has grown to become a leading innovator in the field of semiconductor failure analysis and R&D.  MultiProbe’s Atomic Force nanoProber (AFP) is a non-destructive semiconductor fault isolation and probing tool that has proven capability on today’s smallest technology nodes.  Leading semiconductor companies around the world rely on the AFP as a key measurement capability in their FA process flow (1a).

Suppliers and Buyers

MultiProbe’s customers include engineers and manufacturing professionals in very high-tech, ISO certified organizations (2).

Multiprobe and Evans Analytical Group (EAG) are partnering to offer semiconductor manufacturers and designers access to Atomic Force nanoProbing (AFP). EAG will be the point of contact and manage the customer’s project, starting with definition of scope and initial sample prep / inspection, after which MultiProbe utilizes AFP to perform high accuracy characterization of individual devices (1b).

In 2007, Agilent Technologies Inc. and Multiprobe Inc. expanded the companies' strategic partnership. As a result, Multiprobe's Multiscan Atomic Force Prober (AFP), the world's highest-resolution nanoprober, will be sold and supported by Agilent to customers in Asia and Japan. This arrangement strengthens the existing relationship between the two companies and expands Agilent's product offerings to include the industry's leading solution for failure analysis in semiconductor devices. MultiProbe is already using the Agilent B1500A semiconductor device analyzer in its current products (3).

Innovation and Technology

AFP users that require testing in heated environments are now able to perform fault isolation techniques at elevated temperatures, mimicking the harsh conditions their companies’ final products will face.  MultiProbe announced the release of a Guarded Thermal Chuck. The unit has shown successful results in probing devices at all technology levels.  The Thermal Chuck does the job efficiently without altering image quality or probing experience. It allows users to localize soft failures to a single transistor, under thermal stress. This is a boon to automotive and car safety companies employing advanced technologies; the AFP with the Thermal Chuck in place recreates conditions in which failures can occur while identifying potential chip failures that might have otherwise gone undetected by other probing techniques.  The Thermal Chuck operates at a temperature range between ambient and 120°C. It’s compatible with up to 6 AFP probe heads and a CAD navigation precision stage and can monitor current with fempto amp resolution, or apply voltage for either a DC current image or an AC Scanning Capacitance image (SCM)(4).


  • Offline AFP Nanoprobing Failure Analysis
  • In-line AFP Nanoprobing Failure Analysis
  • Probe tips(1c).


  1. MultiProbe Inc. (2013). Retrieved on October 2, 2013
    1. “About Us” from
    2. “Nanoprobing Services” from
    3. “Products” from
  2. Nanotechnology Now (2009, March 13).  “Leading Supplier of Nanoprobing Tools to the Semiconductor Industry Embraces ISO Quality Standard; MultiProbe Inc. Earns ISO 9001:2008 Certification.” Retrieved on October 2, 2013 from
  3. Nanowerk (2007, December 7). “Agilent Technologies and Multiprobe to Bring World's Highest-Resolution Nanoprober to Asia.” Retrieved on October 2, 2013 from
  4. Nanowerk (2009, January 26). “MultiProbe Launches Thermal Chuck for Advanced Technology Measurements at Elevated Temperature.”  Retrieved on October 2, 2013 from